Bergquist Company
Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Henkel’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).
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Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.5/30/2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.5/27/2024 -
Bergquist Company Aplicaciones de centros de datosMateriales avanzados que contribuyen a la gestión térmica, la confiabilidad a largo plazo y la protección contra el estrés.4/1/2023 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.7/11/2022 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.4/13/2022 -
Bergquist Company TGF 4500CVO 4.5W/m-K High Dispense Rate Gap FillerHigh dispense rate, thermally conductive liquid gap fillers that use 2K silicone technology.11/9/2021 -
Bergquist Company TGF 3000SF 3.0W/m-K, Sil-Free Gap FillerTwo-part, silicone-free liquid TIM gap filler that provides thermal conductivity of 3.0W/m-K.10/14/2021